Research Area/ Research Interest: Micro fabrication and packaging
Research Paper Topics for: Masters and PhD Thesis and publication
- Robust direct-write dispensing tool and solutions for micro/meso-scale manufacturing and packaging
- Applications of electrochemical microfabrication: An introduction
- Photopatternable conductive PDMS materials for microfabrication
- A CMUT probe for medical ultrasonography: From microfabrication to system integration
- Reliability in MEMS packaging
- Microfabrication of a high pressure bipropellant rocket engine
- Microfabrication of 3D neural probes with combined electrical and chemical interfaces
- Facile, Packaging Substrate-Agnostic, Microfabrication and Assembly of Scalable 3D Metal Microelectrode Arrays for in Vitro Organ-on-a-Chip and Cellular Disease …
- Microfabrication techniques for integrated sensors and microsystems
- Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes
- Microfabrication, Coil Characterization, and Hermetic Packaging of Millimeter-Sized Free-Floating Neural Probes
- Fundamentals of microfabrication: the science of miniaturization
- Advanced MEMS packaging
- Full fabrication and packaging of an implantable multi-panel device for monitoring of metabolites in small animals
- Microfabrication techniques for chemical/biosensors
- Microsensor packaging and system partitioning
- MEMS packaging and microassembly challenges
- Micro-fabrication technologies on recent packaging
- Microelectronic packaging for retinal prostheses
- Microfabrication technologies for a coupled three-dimensional microelectrode, microfluidic array
- Microfabrication and packaging of deformable mirror devices
- Design, fabrication, and packaging of an integrated, wirelessly-powered optrode array for optogenetics application
- Design, fabrication, and packaging of a practical multianalyte-capable optical biosensor
- Micromachining of packaging materials for MEMS using lasers
- Introduction to microfabrication
- A multiscale assembly and packaging system for manufacturing of complex micro-nano devices
- Microfabrication and characterization of spray-coated single-wall carbon nanotube film strain gauges
- Flexible, penetrating brain probes enabled by advances in polymer microfabrication
- Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques
- Status and Development of Materials for Metal Packaging
- Microfabrication and packaging process for a single-chip position, navigation, and timing system
- Manufacturing techniques for microfabrication and nanotechnology
- Fundamental aspects and applications of electrochemical microfabrication
- Microfabrication and packaging of a rubidium vapor cell as a plasma light source for MEMS atomic clocks
- Design and fabrication of a silicon interposer with TSVs in cavities for three-dimensional IC packaging
- Frozen water for MEMS fabrication and packaging applications
- Fabrication and packaging of a fully implantable biosensor array
- Cost-effective precision 3d glass microfabrication for advanced packaging applications
- A microfabrication-based dynamic array cytometer
- Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology
- A micro-direct methanol fuel cell stack with optimized design and microfabrication
- Cost effective 3D Glass Microfabrication for Advanced Packaging Applications
- Microfabrication and characterization of a silicon-based millimeter scale, PEM fuel cell operating with hydrogen, methanol, or formic acid
- Self-assembly for microscale and nanoscale packaging: Steps toward self-packaging
- Fabrication and packaging of a dual sensing electrochemical biotransducer for glucose and lactate useful in intramuscular physiologic status monitoring
- Application of micro/nano technology for thermal management of high power LED packaging–A review
- Packaging design of microsystems and meso-scale devices
- A packaging solution utilizing adhesive-filled TSVs and flip–chip methods
- MEMSlab: A practical MEMS course for the fabrication, packaging, and testing of a single-axis accelerometer
- Packaging of implantable microsystems
- Selection of materials for reduced stress packaging of a microsystem
- MEMS Switch Fabrication and Packaging
- Post-packaging frequency tuning of microresonators by pulsed laser deposition
- Microfabrication of human organs-on-chips
- Re-configurable fluid circuits by PDMS elastomer micromachining
- Two-photon polymerization initiators for three-dimensional optical data storage and microfabrication
- Packaging commercial CMOS chips for lab on a chip integration
- Challenges in interconnection and packaging of microelectromechanical systems (MEMS)
- Microfabrication of 3D hollow structures embedded in glass by femtosecond laser for Lab-on-a-chip applications
- Printing systems for MEMS packaging
- Capillary-driven automatic packaging
- Photodefinable PDMS thin films for microfabrication applications
- Micromachined piezoelectric spirals and ultra-compliant packaging for blood pressure energy harvesters powering medical implants
- Vacuum wafer-level packaging for MEMS applications
- Evaluation of packaging effect on MEMS performance: Simulation and experimental study
- Polymer dispensing and embossing technology for the lens type LED packaging
- SU-8 nanocomposite photoresist with low stress properties for microfabrication applications
- A novel wafer-level hermetic packaging for MEMS devices
- Design and packaging of microreactors for high pressure and high temperature applications
- Low temperature metal-based micro fabrication and packaging technology
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- Liquid crystal polymer (LCP) for MEMS: processes and applications
- Introduction to microsystem packaging technology
- A silicon-based micro direct methanol fuel cell stack with compact structure and PDMS packaging
- MEMS packaging
- MICROFABRICATION ON ELECTRONICS PACKAGING
- Three-dimensional microfabrication of copper column by localized electrochemical deposition
- Gold etching for microfabrication
- Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC)
- Surface micromachine microfluidics: design, fabrication, packaging, and characterization
- Integration and packaging of embedded radial micro-channels for 3D chip cooling
- Scalable high lead-count parylene package for retinal prostheses
- A batch wafer scale LIGA assembly and packaging technique via diffusion bonding
- Review on Analytical Design, Simulation, Fabrication, Characterization, and Packaging Aspects of Micro Electro Mechanical Switches for Radio Frequency …
- Microfabrication by electrochemical metal removal
- Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching
- Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS
- 3D microfabrication by combining microstereolithography and thick resist UV lithography
- MEMS post-packaging by localized heating and bonding
- Polymer-based packaging platform for hybrid microfluidic systems
- Packaging for microelectromechanical and nanoelectromechanical systems
- 2005 INJECTION MOLDED & MICRO FABRICATION ELECTRONIC PACKAGING
- Micromachined packaging for terahertz systems
- Fabrication and packaging of flexible polymeric microantennae for in vivo magnetic resonance imaging
- Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review
- Polymer microfabrication technologies for microfluidic systems
- Cost effective Precision 3D Glass Microfabrication for Electronic Packaging
- TGV Microfabrication Technology for 3D Packaging
- MEMS Packaging Technology
- High performance microsystem packaging: A perspective
- Ultra-Compact Four-Channel 5–18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D Packaging
- Microfabrication and packaging of a rubidium vapor cell as a plasma light source for MEMS atomic clocks
- Molecular Electronic Transducer Based Seismic Motion Sensors Micro-Fabrication, Packaging and Validation
- Performances and procedures modules in micro electro mechanical system packaging technologies
- Fundamentals of microsystems packaging
- MOEMS: Micro-opto-electro-mechanical Systems
- Packaging of the MIT Microengine
- Polycrystalline silicon germanium for fabrication, release, and packaging of microelectromechanical systems
- Fabrication of SiCN ceramic MEMS using injectable polymer-precursor technique
- Microfabrication of cesium vapor cells with buffer gas for MEMS atomic clocks
- Packaging of bio-MEMS: strategies, technologies, and applications
- Electronic components, packaging and production
- Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging
- Mechanical characterizations of laser microwelds for MEMS packaging
- Overview and development trends in the field of MEMS packaging
- Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview
- From structures, packaging to application: a system-level review for micro direct methanol fuel cell
- Fabrication and packaging of microfluidic devices with SU-8 epoxy
- Integrated RF circuits design and packaging in high contrast ceramic-polymer composites
- Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and-systems: a review
- Laser patterning and packaging of CCD-CE-Chips made of PMMA
- The use of silicon microfabrication technology in painless blood glucose monitoring
- Microfabrication and Packaging Issues in the Development of a Planar Silicon Loop Heat Pipe, Using Si02 Fiber Wicks
- Micro direct methanol fuel cell: functional components, supplies management, packaging technology and application
- Micropatterned dry electrodes for brain–computer interface
- Microfabrication and nanotechnology in manufacturing system–An overview
- Novel integration and packaging concepts of highly miniaturized inductively powered neural implants
- A tri-axial touch sensor with direct silicon to PC-board packaging
- Projection microfabrication of three-dimensional scaffolds for tissue engineering
- Fabrication, packaging, and testing of a wafer-bonded microvalve
- Rapid, low cost microfabrication technologies toward realization of devices for dielectrophoretic manipulation of particles and nanowires
- Designing a web-based VR machine for learning of packaging and testing skills
- The influence of lithographic patterning on current distribution: A model for microfabrication by electrodeposition
- Direct-write UV-laser microfabrication of 3D structures in lithium-aluminosilicate glass
- Fabrication and packaging of CMUT using low temperature co-fired ceramic
- Packaging of optical fibers using microfabricated nickel clamps
- Deep proton writing: a rapid prototyping polymer micro-fabrication tool for micro-optical modules
- MEMS packaging and reliability: An undividable couple
- MEMS packaging technologies & applications
- Thermal actuated solid tunable lens
- Special issue on design, test, integration and packaging of MEMS and MOEMS (DTIP 2015), held in Montpellier, France, April 27–30, 2015
- Selective induction heating for MEMS packaging and fabrication
- Low-cost microfabrication for MEMS switches and varactors
- Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D packages
- Planar packaging of free-space optical interconnections
- CMOS amperometric instrumentation and packaging for biosensor array applications
- Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)
- Mixed system and component level T-CAD for micro fabrication
- Optical fiber packaging for MEMS interfacing
- Flexible fabrication, packaging, and detection approach for microscale chromatography systems
- Process simulation of DRIE and its application in tapered TSV fabrication
- Thin‐film microfabrication of electrochemical transducers
- Ceramic packaging in neural implants
- Microfabrication of microlens array by focused ion beam technology
- Sodium Metasilicate-Based Inorganic Composite for Heterogeneous Integration of Microsystems
- Design of double-slot antennas for terahertz array detectors in flip chip packaging
- Three-dimensional microfabrication using synchrotron radiation
- Microfluidics on compliant substrates: recent developments in foldable and bendable devices and system packaging
- Fabrication and characterization of polyimide-based ‘smooth’titanium nitride microelectrode arrays for neural stimulation and recording
- Fundamental principles of optical lithography: the science of microfabrication
- Fabrication and packaging of inertia micro-switch using metal-electroplating technology
- Micro/Nano Fabrication and Packaging Technologies for Bio Systems
- A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Design, test, integration and packaging of MEMS/MOEMS, 2005
- Wafer-level packaging for micro-electro-mechanical systems using surface activated bonding
- Micromachined electrodes for biopotential measurements
- Combining microstereolithography and thick resist UV lithography for 3D microfabrication
- Materials and fabrication issues of micro V-groove for optoelectronics packaging
- Power enhancement of micro thermoelectric generators by microfluidic heat transfer packaging
- MEMS capacitive pressure sensors: a review on recent development and prospective
- Poly (dimethylsiloxane)-based packaging technique for microchip fluorescence detection system applications
- Device level vacuum packaging technologies of MEMS gyroscopes
- Conductive SU8 photoresist for microfabrication
- Development of a diamond microfluidics-based intra-chip cooling technology for GaN
- Microfabrication: LIGA-X and applications
- Formation of silicon-gold eutectic bond using localized heating method
- Stereolithography on silicon for microfluidics and microsensor packaging
- Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs
- Mechanical and electrical characterization of piezoelectric artificial cochlear device and biocompatible packaging
- A novel silicon-based LED packaging module with an integrated temperature sensor
- Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging
- Fabrication and packaging of MEMS based platform for hydrogen sensor using ZnO–SnO 2 composites
- Comparison between microfabrication technologies for metal tooling
- Micro-cross-sectional lithography (μCSL™): Protoyping and packaging for MEMS
- Design, development, fabrication, packaging, and testing of MEMS pressure sensors for aerospace applications
- Printed transistors on paper: Towards smart consumer product packaging
- Multifunctional diffractive optics for optoelectronic system packaging
- Microfabrication of PDMS microchannels using SU-8/PMMA moldings and their sealing to polystyrene substrates
- Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation
- Micro concentrator with opto-sense micro reactor for biochemical IC chip family. 3D composite structure and experimental verification
- Process optimization in high-average-power ultrashort pulse laser microfabrication: how laser process parameters influence efficiency, throughput and quality
- Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices
- Nanosatellites and MEMS fabrication by laser microprocessing
- Packaging technique for a tunable miniature liquid iris operated by electrowetting actuation
- Packaging for biomedical analysis systems
- Hybrid multisite silicon neural probe with integrated flexible connector for interchangeable packaging
- Microelectromechanical systems and packaging
- The effect of diaphragm on performance of MEMS pressure sensor packaging
- Design and packaging of a highly integrated microreactor system for high-temperature on-board hydrogen production
- A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles
- Post-CMOS parylene packaging for on-chip biosensor arrays
- Injection molded & micro fabrication electronic packaging
- Micro-Fabrication Technologies Supporting Advanced Packages
- Packaging of a MEMS based safety and arming device
- Advances in the microfabrication of electrochemical sensors and systems
- Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
- Low cost anodic bonding for MEMS packaging applications
- Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009
- Microfabricated cross-flow chemical reactor for catalyst testing
- Silicon-based LED packaging module with photosensor
- Microfabrication for microfluidics
- Microsensor packaging and system partitioning
- Assembly and packaging of micro systems by using reactive bonding processes
- Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding
- Global collaborative electronic packaging education
- Device packaging techniques for implementing a novel thermal flux method for fluid degassing and charging of a planar microscale loop heat pipe
- Packaging of surface micromachined thin film thermocouples (TFT): comparison of the resistance arc microwelding technique with wire bonding
- Packaging of microsystems
- Materials, structures and packaging
- Micro-optics packaging and integration for structured laser beam shaping
- Micromachining for advanced terahertz: Interconnects and packaging techniques at terahertz frequencies
- Laser welding: providing alignment precision and accuracy to substrate-level packaging
- Fabrication and packaging of microbump interconnections for 3D TSV
- Solid-state microscale lithium batteries prepared with microfabrication processes
- Miniaturized imaging systems
- Micromachined integrated optics for free-space interconnections
- The Simple Fabrication and Packaging of Micro DMFC by MEMS Technology
- Quantitative study of the’MEMSNAS’process for 3D microfabrication using binary lithography
- Packaging of MEMS devices
- SOI for MEMS and advanced packaging
- Microfabrication and application of reservoir pins for liquid transfer in biotechnology
- Design of a micro-Wankel rotary engine for MEMS fabrication
- Design and fabrication of a hybrid silicon three-axial force sensor for biomechanical applications
- Design, Test, Integration and Packaging of MEMS/MOEMS, 2004
- Flexible packaging and interconnect scheme for microfluidic systems
- Novel silicon-based LED packaging module with an integrated photosensing element
- A flexible polymer tube lab-chip integrated with microsensors for smart microcatheter
- The fabrication of all-diamond packaging panels with built-in interconnects for wireless integrated microsystems
- Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging
- Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
- Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film
- Packaging of microfluidic chips via interstitial bonding technique
- Development of modules for micro-optical integration and MOEMS packaging
- Investigation of MEMS vacuum packaging based on fusion welding
- Laser-Induced Forward Transfer (LIFT) technique as an alternative for assembly and packaging of electronic components
- 3D packaging technology to realize miniaturization/high-density and high-performance servers
- Hybrid rigid-flexible magnetoresistive device based on a wafer level packaging technology for micrometric proximity measurements
- Influence Factors Research and Design Factors Analysis on Anode linkage Technology in MEMS Packaging
- Test structures for developing packaging for implantable sensors
- MEMS packaging process by film transfer using an anti-adhesive layer
- Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems
- Post-packaging tuning of microresonators by pulsed laser deposition
- ppb level detection of NO 2 using a WO 3 thin film-based sensor: material optimization, device fabrication and packaging
- Packaging Technology for MEMS
- Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform
- Wafer-level vacuum packaging technology based on selective electroplating
- Micro-optics packaging and integration for high-power diode laser beam combining
- Bottom-up filling of through silicon via (TSV) with Parylene as sidewall protection layer
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2000), Paris, France, 9-11 May 2000: Special Issue, Analog Integrated Circuits and …
- Fabrication and packaging of a microfluidic optical switch using direct-write laser micromachining
- Design, fabrication and packaging of micro-optical components and systems
- Microfabrication using synchrotron radiation
- Packaging and characteristics of a microfluorescence spectroscopy analyzer
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2003), 5-7 May 2003-Mandelieu-La Napoule,” Côte d’Azur”, France: Special issue …
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2004), 12-14 May 2004, Montreux, Switzerland: Special Issue, Analog Integrated …
- A micro-solid oxide fuel cell system as battery replacement
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2001), 25-27 April 2001-Cannes-Mandelieu,” Côte d’Azur”, France: Special Issue …
- MEMS packaging and reliability
- Design, test, integration and packaging of MEMS/MOEMS, 2006
- Smart packaging of electronics and integrated MEMS devices using LTCC
- Heterogeneous Integration/Advanced Packaging.
- Design and fabrication of piezoelectric micro power generators for autonomous microsystems
- Compatibility Analysis of Liquid Gallium and Common Packaging Metals for Application in Electronic Component Thermal Management
- Nanomanufacturing of Smart and Connected Bioelectronics Through Nanomaterial Printing, Hybrid Material Integration, and Soft Packaging
- Microelectronic packaging
- New polymer packaging for planar patch-clamp
- Environmentally isolating packaging for MEMS sensors
- Microfabrication and characterization of liquid core waveguide glass channels coated with Teflon AF
- Zinc bonding for MEMS packaging at the wafer-level
- Mold design and fabrication for production of thermoformed paper-based packaging products
- PECVD Silicon Carbide as a Chemically-Resistant Thin Film Packaging Technology for Microfabricated Antennas
- Advanced packaging and integration technologies for microsensors, phase 1(Final Report, Feb.- Jul. 1994)
- Introduction to MEMS packaging
- Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007)
- Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
- Wafer level packaging for RF MEMS devices using void free copper filled through glass via
- From functional structure to packaging: Full-printing fabrication of a microfluidic chip
- Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
- Design and fabrication of high performance wafer-level vacuum packaging based on glass–silicon–glass bonding techniques
- A precise spacing-control method in MEMS packaging for capacitive accelerometer applications.
