PCB Design and Fabrication – MCQs 25 Score: 0 Attempted: 0/25 Subscribe 1. : What does PCB stand for? (A) Printed Circuit Board (B) Parallel Conduction Base (C) Primary Circuit Board (D) Processed Copper Board 2. : The most commonly used material for PCB substrate is: (A) Copper (B) FR4 (C) Silicon (D) Aluminum 3. : Which of the following is used to etch copper in PCB fabrication? (A) Hydrochloric acid (B) Nitric acid (C) Ferric chloride (D) Sodium hydroxide 4. : In PCB terminology, a “via” is used to: (A) Connect layers (B) Increase resistance (C) Mount components (D) Provide insulation 5. : What is the main purpose of a solder mask? (A) Conduct electricity (B) Protect copper traces (C) Dissolve flux (D) Add mechanical strength 6. : Which layer is typically green in a PCB? (A) Copper layer (B) Substrate (C) Solder mask (D) Silkscreen 7. : The topmost printed layer in a PCB that shows component labels is: (A) Copper layer (B) Ground plane (C) Solder mask (D) Silkscreen 8. : The copper thickness in a standard PCB is usually: (A) 1 mm (B) 35 microns (C) 100 microns (D) 1 micron 9. : Which software is commonly used for PCB design? (A) AutoCAD (B) Eagle (C) Blender (D) Adobe Illustrator 10. : What is the purpose of a ground plane in a PCB? (A) Increase voltage (B) Act as a cooling surface (C) Reduce electromagnetic interference (D) Store data 11. : Double-sided PCBs have copper tracks: (A) Only on the top (B) Only on the bottom (C) On both sides (D) Inside the board 12. : The process of transferring the PCB layout to copper board is called: (A) Etching (B) Drilling (C) Printing (D) Imaging 13. : What is the Gerber file used for? (A) Writing firmware (B) Simulating circuits (C) Fabricating PCBs (D) Testing components 14. : In PCB design, DRC stands for: (A) Design Rule Check (B) Device Routing Circuit (C) Direct Resistor Calculation (D) Dual Relay Control 15. : Which of the following is not a layer in PCB design? (A) Copper (B) Substrate (C) Ground (D) Silkscreen 16. : Which component is typically not placed on the bottom layer of a single-sided PCB? (A) Resistor (B) Capacitor (C) Microcontroller (D) Connector 17. : The process of connecting components to the board is called: (A) Tracing (B) Plating (C) Soldering (D) Masking 18. : Which of these components is polarity sensitive? (A) Resistor (B) Capacitor (Electrolytic) (C) Inductor (D) Fuse 19. : A PCB with components mounted on the surface only is called: (A) Through-hole PCB (B) Hybrid PCB (C) Surface Mount Technology (SMT) (D) Multi-layer PCB 20. : In PCB manufacturing, drilling is mainly done to create: (A) Copper traces (B) Vias and through-holes (C) Ground planes (D) Silkscreen labels 21. : The minimum track width in a PCB depends on: (A) Voltage level (B) Current carrying capacity (C) Board color (D) Component size only 22. : Which is used for mechanical support and electrical connection in a PCB? (A) Silkscreen (B) Via (C) Trace (D) Pad 23. : Thermal relief is used in PCBs to: (A) Prevent short circuits (B) Improve soldering by limiting heat transfer (C) Increase EMI (D) Block signal flow 24. : What happens if trace width is too narrow for the current? (A) Signal boosts (B) Trace may overheat and fail (C) Faster signal transmission (D) PCB color changes 25. : The outermost layer of the PCB that protects from oxidation is called: (A) Copper layer (B) Substrate (C) Silkscreen (D) Solder mask Related Posts:Research Topics of Micro fabrication and packagingProcess Control Block PCB[PPSC PAKISTAN ] Syllabus assistant executive engineers / sub divisional officer / assistant design engineer / assistant design officer /…ASSISTANT EXECUTIVE ENGINEERS / SUB DIVISIONAL OFFICER / ASSISTANT DESIGN ENGINEER / ASSISTANT DESIGN OFFICER / ASSISTANT DIRECTOR FLOOD…AND Gate and NAND gate in DLD Digital Logic DesignData Analysis And Design MCQs