Fabrication and characterization techniques – MCQs – EE

1. Nanomaterial fabrication involves controlling material dimensions below:
(A) 1 mm
(B) 100 nm
(C) 10 µm
(D) 1 µm

2. The top-down approach in nanofabrication refers to:
(A) Breaking down bulk material into nanosized particles
(B) Assembling atoms and molecules
(C) Growing nanostructures atom by atom
(D) Self-assembly of molecules

3. The bottom-up approach involves:
(A) Assembling atoms or molecules to form nanostructures
(B) Etching bulk material
(C) Milling large structures
(D) Cutting thin films

4. Photolithography is commonly used for:
(A) Pattern transfer in semiconductor fabrication
(B) Growing nanowires
(C) Coating polymers
(D) Mixing nanofluids

5. The main light source in photolithography is typically:
(A) Ultraviolet (UV) light
(B) Infrared light
(C) Visible light
(D) X-rays

6. Electron beam lithography (EBL) provides:
(A) Very high resolution patterning
(B) Low-cost mass production
(C) Large-area fabrication
(D) Chemical etching

7. Nanoimprint lithography works by:
(A) Mechanically pressing a mold into a resist layer
(B) Using UV light for exposure
(C) Magnetic field alignment
(D) Wet etching

8. Chemical Vapor Deposition (CVD) is a:
(A) Bottom-up thin film deposition method
(B) Mechanical cutting process
(C) Wet etching method
(D) Physical cleaning process

9. In Physical Vapor Deposition (PVD), material is:
(A) Evaporated or sputtered and condensed on a substrate
(B) Grown chemically in solution
(C) Deposited using bacteria
(D) Formed by etching

10. Atomic Layer Deposition (ALD) is characterized by:
(A) Layer-by-layer atomic precision deposition
(B) Random film growth
(C) High-temperature oxidation
(D) Plasma etching

11. Etching is used to:
(A) Remove specific material layers selectively
(B) Deposit metal layers
(C) Add polymer coating
(D) Grow nanocrystals

12. Wet etching removes material through:
(A) Chemical solutions
(B) Ion bombardment
(C) Mechanical cutting
(D) Thermal diffusion

13. Dry etching commonly uses:
(A) Plasma or reactive ions
(B) Acids
(C) Solvents
(D) Mechanical abrasives

14. Scanning Electron Microscopy (SEM) provides:
(A) High-resolution surface imaging using electron beams
(B) Internal atomic structure
(C) Thermal conductivity data
(D) Magnetic response

15. The resolution of SEM is typically:
(A) A few nanometers
(B) A few micrometers
(C) A few millimeters
(D) Several centimeters

16. Transmission Electron Microscopy (TEM) is used for:
(A) Atomic-scale internal imaging of thin samples
(B) Measuring surface roughness
(C) Detecting gas molecules
(D) Spectroscopy only

17. Atomic Force Microscopy (AFM) measures:
(A) Surface topography at the nanoscale
(B) Temperature variation
(C) Optical reflection
(D) Electrical resistance

18. In AFM, the probe tip interacts with:
(A) Surface atoms of the sample
(B) Magnetic fields
(C) Sound waves
(D) Laser beams

19. X-ray Diffraction (XRD) is primarily used for:
(A) Determining crystal structure and phase identification
(B) Measuring optical absorption
(C) Detecting surface roughness
(D) Measuring electrical resistance

20. The basic principle of XRD is:
(A) Diffraction of X-rays by crystal planes
(B) Absorption of X-rays
(C) Scattering of light waves
(D) Electron emission

21. Energy Dispersive X-ray Spectroscopy (EDS) is often used with:
(A) SEM or TEM
(B) AFM
(C) Optical microscope
(D) STM only

22. EDS provides information about:
(A) Elemental composition
(B) Surface roughness
(C) Crystallinity
(D) Optical properties

23. Raman Spectroscopy is based on:
(A) Inelastic scattering of light
(B) Elastic reflection
(C) Magnetic absorption
(D) Ionization of atoms

24. Fourier Transform Infrared (FTIR) Spectroscopy is used to:
(A) Identify chemical bonds and functional groups
(B) Measure electrical conductivity
(C) Detect crystal grain size
(D) Observe magnetic domains

25. Ellipsometry is a technique used for measuring:
(A) Thin film thickness and refractive index
(B) Electrical conductivity
(C) X-ray absorption
(D) Surface magnetism

26. Focused Ion Beam (FIB) systems are used for:
(A) Milling, imaging, and micro/nanofabrication
(B) Optical lithography
(C) Wet chemical synthesis
(D) Polymer molding

27. The resolution of a TEM can reach up to:
(A) Sub-nanometer scale
(B) 1 µm
(C) 10 nm
(D) 100 µm

28. Self-assembly in nanofabrication refers to:
(A) Spontaneous organization of molecules into ordered structures
(B) Manual alignment of atoms
(C) Chemical etching
(D) Thermal oxidation

29. Langmuir-Blodgett technique is used for:
(A) Forming monolayers of organic molecules on substrates
(B) Cutting thin films
(C) Oxidizing metals
(D) Cleaning surfaces

30. The major challenge in nanofabrication is:
(A) Achieving precise control at atomic scale
(B) High temperature requirement
(C) Magnetic alignment
(D) Optical interference