VLSI Design Flow — MCQs – EE

1. The term VLSI stands for:
(A) Very Large Scale Integration
(B) Variable Logic System Integration
(C) Very Long Semiconductor Integration
(D) Vast Logic Signal Interface

2. VLSI design deals with the integration of:
(A) Thousands to millions of transistors on a single chip
(B) One or two transistors
(C) Only passive components
(D) Only analog circuits

3. The first step in the VLSI design flow is:
(A) System specification
(B) Logic synthesis
(C) Layout design
(D) Fabrication

4. The final step in the VLSI design flow is:
(A) Fabrication
(B) Simulation
(C) Schematic entry
(D) Physical design

5. The process of converting a high-level design into a hardware description is called:
(A) Design entry
(B) Logic synthesis
(C) Verification
(D) Layout

6. HDL in VLSI stands for:
(A) Hardware Description Language
(B) High Density Logic
(C) Hybrid Design Logic
(D) Hardware Design Layout

7. Commonly used HDLs in VLSI are:
(A) VHDL and Verilog
(B) C and C++
(C) MATLAB and Python
(D) Assembly and Fortran

8. Logic synthesis is the process of converting:
(A) RTL design to gate-level representation
(B) Layout to schematic
(C) Circuit to physical mask
(D) HDL to netlist

9. The stage where the physical layout of the circuit is created is known as:
(A) Physical design
(B) Logic synthesis
(C) Behavioral modeling
(D) Testing

10. The verification process ensures that:
(A) The design meets the specifications
(B) The chip is fabricated correctly
(C) The layout area is minimized
(D) The packaging is complete

11. The process of checking functionality using simulation tools is called:
(A) Functional verification
(B) Design for test
(C) Fault modeling
(D) Place and route

12. RTL in VLSI design stands for:
(A) Register Transfer Level
(B) Random Test Logic
(C) Reconfigurable Transistor Layout
(D) Real Time Logic

13. The step of placing components and routing interconnections is known as:
(A) Place and route
(B) Schematic capture
(C) Logic synthesis
(D) Simulation

14. The GDSII file format is used for:
(A) Layout data exchange
(B) HDL simulation
(C) Logic synthesis
(D) Functional verification

15. Design Rule Check (DRC) ensures:
(A) The layout follows manufacturing rules
(B) The circuit logic is correct
(C) The timing is accurate
(D) The power is minimized

16. Layout Versus Schematic (LVS) check is performed to:
(A) Compare layout with schematic
(B) Verify simulation results
(C) Check design rules
(D) Analyze thermal effects

17. Electrical Rule Check (ERC) ensures:
(A) No connectivity or electrical violations exist
(B) The layout is compact
(C) The fabrication mask is ready
(D) The simulation matches HDL

18. Timing analysis in VLSI ensures that:
(A) The circuit meets setup and hold time constraints
(B) The chip size is minimized
(C) The power is maximum
(D) The area utilization is low

19. Floorplanning in VLSI design refers to:
(A) Arranging major blocks on the chip
(B) Checking timing delays
(C) Testing logic gates
(D) Assigning signal names

20. Parasitic extraction is used to:
(A) Estimate resistance and capacitance in the layout
(B) Identify fabrication errors
(C) Verify logical functionality
(D) Generate test vectors

21. Power analysis in VLSI helps to:
(A) Estimate total power consumption
(B) Increase chip size
(C) Decrease performance
(D) Add redundancy

22. The back-end design process mainly involves:
(A) Physical design and verification
(B) Behavioral modeling
(C) HDL coding
(D) Logic synthesis

23. Front-end design includes:
(A) HDL design, synthesis, and simulation
(B) Mask generation
(C) DRC and LVS
(D) Wafer fabrication

24. The mask used in fabrication defines:
(A) The pattern of each layer on the chip
(B) The packaging dimensions
(C) The test parameters
(D) The power connections

25. Design for Testability (DFT) helps in:
(A) Easier testing of manufactured chips
(B) Reducing fabrication cost
(C) Increasing transistor count
(D) Improving simulation time

26. The tool used for gate-level simulation is called:
(A) Logic simulator
(B) Layout editor
(C) Floorplanner
(D) Mask generator

27. Tape-out in VLSI refers to:
(A) Sending final layout data for fabrication
(B) Initial testing
(C) Design entry
(D) Verification stage

28. The process of fabricating multiple layers on a wafer is called:
(A) Photolithography
(B) Simulation
(C) Verification
(D) Synthesis

29. Design abstraction levels in VLSI include:
(A) Behavioral, structural, and physical
(B) Only physical level
(C) Logical and electrical only
(D) Packaging and testing

30. The main goal of the VLSI design flow is to:
(A) Achieve functional, timing, and physical correctness
(B) Increase circuit complexity
(C) Reduce transistor reliability
(D) Eliminate synthesis tools