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VLSI Design — MCQs – EE

1. VLSI stands for:

(A) Very Large Scale Integration


(B) Variable Logic Signal Integration


(C) Very Low Signal Interface


(D) Virtual Logic System Integration



2. VLSI technology involves the integration of:

(A) Millions of transistors on a single chip


(B) One transistor per chip


(C) Only analog circuits


(D) Only power circuits



3. The main advantage of VLSI technology is:

(A) High speed and low power consumption


(B) Large size and high cost


(C) Complex wiring


(D) High noise generation



4. The basic building block of digital VLSI circuits is:

(A) Logic gate


(B) Transformer


(C) Inductor


(D) Resistor



5. MOSFETs are widely used in VLSI because they:

(A) Consume less power and occupy less space


(B) Require high voltage


(C) Are slower than BJTs


(D) Are difficult to fabricate



6. The two main design approaches in VLSI are:

(A) Full custom and semi-custom design


(B) Analog and digital design


(C) Small scale and large scale


(D) Bipolar and CMOS design



7. CMOS technology uses:

(A) Complementary NMOS and PMOS transistors


(B) Only NMOS transistors


(C) Only PMOS transistors


(D) Bipolar transistors



8. The main advantage of CMOS logic over TTL logic is:

(A) Low power dissipation


(B) High power requirement


(C) Larger size


(D) Higher voltage levels



9. The physical layout of a VLSI chip is represented by:

(A) Mask layout


(B) Circuit diagram


(C) Truth table


(D) Block diagram



10. The fabrication of VLSI circuits is done on:

(A) Silicon wafers


(B) Glass plates


(C) Plastic sheets


(D) Aluminum foil



11. The process of designing the circuit functionality is called:

(A) Logic design


(B) Layout design


(C) Physical design


(D) Mask generation



12. The physical design step in VLSI involves:

(A) Placement and routing of components


(B) Writing code for logic


(C) Testing software


(D) Compiling HDL code



13. HDL stands for:

(A) Hardware Description Language


(B) High Design Layout


(C) Hardware Design Logic


(D) High Density Logic



14. Examples of HDL are:

(A) VHDL and Verilog


(B) C and Python


(C) Java and Kotlin


(D) Assembly and COBOL



15. The primary goal of VLSI design automation tools is to:

(A) Reduce design time and complexity


(B) Increase chip size


(C) Decrease speed


(D) Eliminate digital logic



16. ASIC stands for:

(A) Application Specific Integrated Circuit


(B) Advanced System Integrated Controller


(C) Analog Signal Integrated Chip


(D) Automated Silicon Interconnect Circuit



17. FPGA stands for:

(A) Field Programmable Gate Array


(B) Fixed Processing Gate Array


(C) Fast Programmable Graphics Adapter


(D) Functional Power Grid Array



18. The main advantage of an FPGA is:

(A) Reconfigurability after fabrication


(B) Permanent logic configuration


(C) High fabrication cost


(D) Slow operation



19. The term “scaling” in VLSI design refers to:

(A) Reducing the size of transistors and interconnections


(B) Increasing chip power


(C) Increasing transistor count


(D) Expanding chip area



20. Power dissipation in CMOS circuits mainly occurs during:

(A) Switching transitions


(B) Idle state


(C) DC operation


(D) Leakage path removal



21. Interconnects in VLSI are used for:

(A) Connecting various components on a chip


(B) Amplifying signals


(C) Storing data


(D) Generating clock pulses



22. The design rule checking (DRC) ensures:

(A) Layout follows manufacturing constraints


(B) Logic correctness


(C) Functionality testing


(D) Simulation accuracy



23. The process of verifying logical correctness of a design is called:

(A) Simulation


(B) Fabrication


(C) Synthesis


(D) Routing



24. The process of converting HDL code into gate-level netlist is called:

(A) Synthesis


(B) Simulation


(C) Placement


(D) Routing



25. The most commonly used semiconductor material for VLSI chips is:

(A) Silicon


(B) Germanium


(C) Gallium Arsenide


(D) Indium Phosphide



26. The clock distribution network in a chip is used to:

(A) Synchronize all sequential elements


(B) Provide data storage


(C) Reduce signal power


(D) Filter noise



27. The yield of a VLSI process depends on:

(A) Defect density and chip area


(B) Frequency of operation


(C) Input voltage


(D) Clock speed



28. The packaging of a VLSI chip provides:

(A) Mechanical protection and electrical connections


(B) Amplification of signals


(C) Noise reduction


(D) Software interface



29. EDA tools are primarily used in VLSI for:

(A) Electronic Design Automation


(B) Electrical Device Analysis


(C) Energy Distribution Application


(D) Error Detection Algorithm



30. The main trend in VLSI design is towards:

(A) Higher integration and lower power


(B) Larger chip size and higher voltage


(C) Manual layout design


(D) Fewer transistors per chip



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